NVI-211 series
It is a device that can perform visual inspection on
the device on the sheet attached to the dicing ring.
A device that inspects the appearance of chips
on wafers.
Our original visual inspection measurement method,the visual inspection measurement time has been shortened.
Applicable device | Various chip device or die |
---|---|
Supply wafer ring | Wafer ring (maximum 8 inch wafer ring) |
Cycle time | Fastest 75 [msec / piece] Best condition |
Power supply | Single-phase AC200 [V] ,AC220 [V],AC230 [V] 50/60 [Hz] (transformer tap changer) |
External dimensions | W890×H1,470×D930[mm] |
Image inspection function | 2,448 x 2,058 pixel camera Theoretical resolution 1.73 [μm] |
For document requests and inquiries, please contact us using the email form below or by phone.
+81-428-31-8211