It is a Sorting handler that transfers the device
attached to the sheet to another sheet for each rank
based on the MAP information.


 Features of Die Sorter NST-610 series


It is a device that classifies by rank based on the
measurement result information obtained by the
prober in the previous process and stores it in a

Basic specifications

Applicable device Various chip device or die 
Device or chip size □0.15~2.0[mm] Thickness 0.7 [mm] or less
* If you want to share it, please contact us separately.
Cycle time Fastest 85msec / piece Best condition
Wafer ring size Wafer ring  (Up to 8 inch wafer ring)
Number of classifications 125 classifications (for flat rings)
Power supply Single-phase AC220 [V] / 10A
External dimensions W1,330×H1,715×D1,235[mm]
* Equipment specifications and processing capacity vary depending on the size and shape of parts, measurement time,
   number of measurement items, etc., so we will make a decision after consultation.
* The photos shown are for illustrative purposes only. 
   Please note that the actual color may differ due to shooting and printing.

Wafer sheet handler lineup


Wafer ring taping handler
NCT-6300R series

ウェーハ素子外観検査装置 NVI-211シリーズ

 Wafer element visual
inspection equipment
NVI-211 series

Die mapping sorter WS-12S series

Die mapping sorter
WS-12S series


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