NST-610 series
Transfer function Die Sorter
NST-610 series
It is a Sorting handler that transfers the device
attached to the sheet to another sheet for each rank
based on the MAP information.
Features of Die Sorter NST-610 series
It is a device that classifies by rank based on the
measurement result information obtained by the
prober in the previous process and stores it in a
magazine.
Basic specifications
| Applicable device | Various chip device or die |
|---|---|
| Device or chip size | □0.15～2.0[mm] Thickness 0.7 [mm] or less * If you want to share it, please contact us separately. |
| Cycle time | Fastest 85msec / piece Best condition |
| Wafer ring size | Wafer ring (Up to 8 inch wafer ring) |
| Number of classifications | 125 classifications (for flat rings) |
| Power supply | Single-phase AC220 [V] / 10A |
| External dimensions | W1,330×H1,715×D1,235[mm] |
number of measurement items, etc., so we will make a decision after consultation.
* The photos shown are for illustrative purposes only.
Please note that the actual color may differ due to shooting and printing.
Wafer sheet handler lineup
Wafer ring taping handler
NCT-6300R series
Wafer element visual
inspection equipment
NVI-211 series
Die mapping sorter
WS-12S series
CONTACT
For document requests and inquiries, please contact us using the email form below or by phone.
Click here for inquiries by phone
+81-428-31-8211