wafer RING LOADING series
It is a Sorting handler that transfers the device attached to the sheet to another sheet for each rank based on the MAP information.
For document requests and inquiries, please contact us using the email form below or by phone.
Applicable device | Various chip device or die |
---|---|
Device or chip size | □0.15~2.0[mm] Thickness 0.7 [mm] or less * If you want to share it, please contact us separately. |
Cycle time | Fastest 85msec / piece Best condition |
Wafer ring size | Wafer ring (Up to 8 inch wafer ring) |
Number of classifications | 125 classifications (for flat rings) |
Power supply | Single-phase AC220 [V] / 10A |
External dimensions | W1,330×H1,715×D1,235[mm] |
It is a structured device that can add image inspection, electrical inspection,
and optical system inspection.
It is a device that can perform visual
inspection on the device on the sheet
attached to the dicing ring.
As a pioneer of embossed carrier tape, we provide the industry's highest level products with quality, management system, in-house mold manufacturing technology, original molding method, and in-house molding machine cultivated over a long history.
With the manufacture of carrier tape "Taping machine" that wraps electronic parts in embossed tape, We also develop, manufacture, and sell "Sorting machines" that sort semiconductors by rank.
For document requests and inquiries, please contact us using the email form below or by phone.
+81-428-31-8211