WS-12S series
Die mapping sorter
WS-12S series
WS-12S is a fully automatic IC die sorter.
The vertical, parallel wafer ring and storage ring
design (patented) leads the industry in sorting speed.
Feature of WS-12S series
12” / 8” wafers can be handled on both the supply side and the storage side.
By making the wafer ring vertical, it is less affected by dust and dirt, making it possible to pick up in the shortest distance and improving processing capacity.
Basic specifications
| Target products | Various chip parts |
|---|---|
| Device or chip size | □0.2~12[mm] Thickness 0.1~0.8 [mm] |
| Cycle time | 0.18 [seconds/piece] |
| Supply wafer frame | 12″ DISCO DTF-12-1 (8″ DISCO DTF-8-1 is optional) |
| Number of classifications | 1 BIN cassette: 13 BIN frame storage/cassette *Maximum 13 BIN |
| Power source | Single-phase AC200 [V] / 10A |
| External dimensions | W1,330 x H2,100 x D1,260 [mm] Weight 1,400 kg |
number of measurement items, etc., so we will make a decision after consultation.
* The photos shown are for illustrative purposes only.
Please note that the actual color may differ due to shooting and printing.
Other wafer loading unit handlers
Transfer function
die Sorter
NST-610 series
Wafer ring taping handler
NCT-6300R series
Wafer element visual
inspection equipment
NVI-211 series
CONTACT
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+81-428-31-8211