WS-12S series
WS-12S is a fully automatic IC die sorter.
The vertical, parallel wafer ring and storage ring
design (patented) leads the industry in sorting speed.
12” / 8” wafers can be handled on both the supply side and the storage side.
By making the wafer ring vertical, it is less affected by dust and dirt, making it possible to pick up in the shortest distance and improving processing capacity.
Target products | Various chip parts |
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Device or chip size | □0.2~12[mm] Thickness 0.1~0.8 [mm] |
Cycle time | 0.18 [seconds/piece] |
Supply wafer frame | 12″ DISCO DTF-12-1 (8″ DISCO DTF-8-1 is optional) |
Number of classifications | 1 BIN cassette: 13 BIN frame storage/cassette *Maximum 13 BIN |
Power source | Single-phase AC200 [V] / 10A |
External dimensions | W1,330 x H2,100 x D1,260 [mm] Weight 1,400 kg |
For document requests and inquiries, please contact us using the email form below or by phone.
+81-428-31-8211