NVI-211 series
It is a device that can perform visual inspection on
the device on the sheet attached to the dicing ring.
A device that inspects the appearance of chips
on wafers.
Our original visual inspection measurement method,
The visual inspection measurement time has been
shortened.
For document requests and inquiries, please contact us using the email form below or by phone.
Applicable device | Various chip device or die |
---|---|
Supply wafer ring | Wafer ring (maximum 8 inch wafer ring) |
Cycle time | Fastest 75 [msec / piece] Best condition |
Power supply | Single-phase AC200 [V] ,AC220 [V],AC230 [V] 50/60 [Hz] (transformer tap changer) |
External dimensions | W890×H1,470×D930[mm] |
Image inspection function | 2,448 x 2,058 pixel camera Theoretical resolution 1.73 [μm] |
It is a structured device that can add
image inspection, electrical inspection,
and optical system inspection.
It is a Sorting machine that transfers
the device attached to the sheet to
another sheet for each rank based on
the MAP information.。
As a pioneer of embossed carrier tape, we provide the industry's highest level products with quality, management system, in-house mold manufacturing technology, original molding method, and in-house molding machine cultivated over a long history.
With the manufacture of carrier tape "Taping machine" that wraps electronic parts in embossed tape, We also develop, manufacture, and sell "Sorting machines" that sort semiconductors by rank.
For document requests and inquiries, please contact us using the email form below or by phone.
+81-428-31-8211