It is a device that can perform visual inspection on
the device on the sheet attached to the dicing ring. 
A device that inspects the appearance of chips
on wafers.
Our original  visual inspection measurement method,the visual inspection measurement  time has been shortened.

Product Videos

Basic specifications

Applicable device Various chip device or die 
Supply wafer ring Wafer ring (maximum 8 inch wafer ring)
Cycle time Fastest 75 [msec / piece]   Best condition
Power supply Single-phase AC200 [V] ,AC220 [V],AC230 [V]
50/60 [Hz] (transformer tap changer)
External dimensions W890×H1,470×D930[mm]
Image inspection function 2,448 x 2,058 pixel camera
Theoretical resolution 1.73 [μm]
* Equipment specifications and processing capacity vary depending on the size and shape of parts, measurement time,
   number of measurement items, etc., so we will make a decision after consultation.
* The photos shown are for illustrative purposes only.
 Please note that the actual color may differ due to shooting and printing.

Wafer sheet handler lineup

移載機能ダイソータNST- 610シリーズ

Transfer function
die Sorter
NST-610 series


Wafer ring taping handler
NCT-6300R series

Die mapping sorter WS-12S series

Die mapping sorter
WS-12S series


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