Sheet SYSTEM DEVICE
WAFER SHEET HANDLER
YAC Garter Wafer sheet handler
For Ultra-small and ultra-thin electronic components
at high speed wafer ring based equipment with the
development concept of four damageless
(supply, transportation, inspection, and storage).
Features of Wafer sheet handler
①Device supply by dicing ring
In the Wafer ring supply, the device attached to the 8-inch and 12-inch dicing rings will be picked
up.
②Support for ultra-small and ultra-thin devices
Device shape We can handle up to 0402 products.
③Various device lineup
●Transfer function (Die Sorter) NST-610 series
●Taping device with various inspection functions
NCT-6300R series
●Element (Die) visual inspection device
NVI-211 series
●Die mapping sorter WS-12S series
Video of wafer sheet handler
Wafer sheet handler lineup
Transfer function
die Sorter
NST-610 series
Wafer ring taping handler
NCT-6300R series
Wafer element visual
inspection equipment
NVI-211 series
Die mapping sorter
WS-12S series
CONTACT
For document requests and inquiries, please contact us using the email form below or by phone.
Click here for inquiries by phone
+81-428-31-8211