For document requests and inquiries, please contact us using the email form below or by phone.
It is possible to inspect metal wiring and die bonding inside semiconductor devices such as
silicon wafers, chips, MEMS, and CSP.
Including the unique measurement of
LD device
FFP measurement NFP measurement Pulse measurement
Optical measurements are also available.
In addition to the unique measurement
of LED devices, optical measurement in
the infrared, visible, and ultraviolet
regions is possible.
As a pioneer of embossed carrier tape, we provide the industry's highest level products with quality, management system, in-house mold manufacturing technology, original molding method, and in-house molding machine cultivated over a long history.
With the manufacture of carrier tape "Taping machine" that wraps electronic parts in embossed tape, We also develop, manufacture, and sell "Sorting machines" that sort semiconductors by rank.
For document requests and inquiries, please contact us using the email form below or by phone.
+81-428-31-8211