Image inspection equipment
We select image processing equipment, including lighting, and provide GUI solutions tailored to
image processing, control, and requests.
In addition to image processing, we also support the construction of automatic systems embedded
in the equipment.
For document requests and inquiries, please contact us using the email form below or by phone.
Features of near-infrared image inspection
It is possible to inspect metal wiring and die bonding inside semiconductor devices such as
silicon wafers, chips, MEMS, and CSP.
Target material
Si (silicon) , GaAs (gallium arsenide) , ceramic
Tester & Image inspection equipment lineup
LD tester
LX72 series
Including the unique measurement of
LD device
FFP measurement NFP measurement Pulse measurement
Optical measurements are also available.
LED tester
LX47 series
In addition to the unique measurement
of LED devices, optical measurement in
the infrared, visible, and ultraviolet
regions is possible.
CONTACT
For document requests and inquiries, please contact us using the email form below or by phone.
Click here for inquiries by phone
+81-428-31-8211