We select image processing equipment, including lighting, and provide GUI solutions tailored
to image processing, control, and requests.
In addition to image processing, we also support the construction of automatic systems
embedded in the equipment.
It is possible to inspect metal wiring and die bonding inside
semiconductor devices such as silicon wafers, chips, MEMS,
Si (silicon) , GaAs (gallium arsenide) , ceramic
Including the unique measurement of
FFP measurement NFP measurement Pulse measurement
Optical measurements are also available.
In addition to the unique measurement
of LED devices, optical measurement in
the infrared, visible, and ultraviolet
regions is possible.
For document requests and inquiries, please contact us using the email form below or by phone.