Image inspection equipment  system
We select image processing equipment, including lighting, and provide GUI solutions tailored to
image processing, control, and requests.

In addition to image processing, we also support the construction of automatic systems embedded
in the equipment.

For document requests and inquiries, please contact us using the email form below or by phone.


Features of near-infrared image inspection

It is possible to inspect metal wiring and die bonding inside semiconductor devices such as
silicon wafers, chips, MEMS, and CSP. 


Target material
 Si (silicon) , GaAs (gallium arsenide) ,  ceramic
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Tester &  Image inspection equipment lineup

LD tester
LX72 series

Including the unique measurement of
LD device
FFP measurement NFP measurement Pulse measurement
Optical measurements are also available.

LED tester
LX47 series

In addition to the unique measurement
of LED devices, optical measurement in
the infrared, visible, and ultraviolet
regions is possible.


Carrier tape business

As a pioneer of embossed carrier tape, we provide the industry's highest level products with quality, management system, in-house mold manufacturing technology, original molding method, and in-house molding machine cultivated over a long history.

Carrier tape business

Automatic machine business

With the manufacture of carrier tape "Taping machine" that wraps electronic parts in embossed tape, We also develop, manufacture, and sell "Sorting machines" that sort semiconductors by rank.

Automatic machine business

CONTACT

For document requests and inquiries, please contact us using the email form below or by phone.

Click here for inquiries by phone

+81-428-31-8211

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